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Global Shutter vs Rolling Shutter in Image Sensors 1. Rolling ShutterRolling shutter, denoted as Rolling Shutter, is characterized by the sequential exposure of CMOS pixels (diodes). In this method, CMOS pixels are exposed one after another, which allows for higher frame rates. However, a drawback is that when the subject moves rapidly, issues such as partial exposure, skew, and wobble may occur. For example, the rotating blades of a propeller may exhibit image distortion due to the rolling shutter effect. 2. Global ShutterGlobal shutter, also known as Global Shutter, is defined by the entire scene being exposed simultaneously. All sensor pixels (diodes) collect light and are exposed at the same time. Unlike the rolling shutter, this simultaneous exposure method eliminates the “jelly effect.” CCD sensors operate on the global shutter principle, where all pixels are exposed simultaneously. However, global shutter also has its disadvantages. It is well-suited for applications with short exposure times (e.g., <500 μs), but when the exposure time is longer (e.g., >500 μs), noise becomes more significant, making rolling shutter more suitable in such cases. Definition of ShutterA shutter is a mechanism in a camera that controls the effective exposure time of the photosensitive medium. It is a critical component of a camera, and its structure, design, and functionality are key indicators of the camera’s quality. Generally, a wider range of shutter speeds is preferable. Shutter speeds are measured in seconds, with shorter durations suitable for capturing fast-moving subjects. For instance, some cameras boast shutter speeds as fast as 1/16,000 second, enabling them to freeze rapidly moving objects. Conversely, for capturing scenes like nighttime traffic or creating the silky effect of flowing water, longer shutter speeds are required. Shutter SpeedShutter speed is measured in seconds. Common shutter speeds include: 1, 1/2, 1/4, 1/8, 1/15, 1/30, 1/60, 1/125, 1/250, 1/500, 1/1000, 1/2000, etc. The exposure difference between adjacent shutter speeds is one stop. For example, 1/60 second allows twice the exposure of 1/125 second, meaning 1/60 second is one stop slower or lower than 1/125 second. Global shutter achieves exposure by capturing the entire image simultaneously. All pixels of the sensor collect light and are exposed at the same time. Once the preset exposure time elapses, the sensor stops collecting light and converts the exposed image into an electronic image. There is no physical shutter involved in this process. At the start of exposure, the sensor begins collecting light, and at the end, the light collection circuit is cut off. The sensor’s readout value then constitutes a complete image. Rolling shutter operates by exposing the sensor row by row via a control chip. Like global shutter, there is no physical shutter. Instead, the sensor’s sensitivity to light is controlled by powering on and off different parts at different times, exposing rows sequentially until all pixels have been exposed. The entire process is completed in a very short time, typically between 1/48 and 1/60 second. Advantages and Disadvantages in SLAM Applications What Is a Shutter?A shutter is a mechanism in a camera that controls the effective exposure time of the photosensitive medium. It is a critical component of a camera, and its structure, design, and functionality are key indicators of the camera’s quality. What Is Global Shutter (Total Shutter)?Global shutter exposes the entire scene simultaneously. All sensor pixels collect light and are exposed at the same time. At the start of exposure, the sensor begins collecting light; at the end, the light collection circuit is cut off. The sensor’s readout value then forms a complete image. CCD sensors operate on the global shutter principle, where all pixels are exposed simultaneously. What Is Rolling Shutter?Unlike global shutter, rolling shutter achieves exposure by scanning and exposing the sensor row by row. At the start of exposure, the sensor begins scanning and exposing rows sequentially until all pixels have been exposed. The entire process is completed in an extremely short time, with different rows of pixels being exposed at different times. Disadvantages Global shutter is suitable for applications with short exposure times (e.g., <500 μs), while rolling shutter is preferable for longer exposure times (e.g., >500 μs) due to its lower noise and higher frame rates. Views: 20

MIPI, DVP, and USB interface camera differ fundamentally in four dimensions: data transmission method, hardware adaptation, performance characteristics, and application scenarios. Essentially, they are distinct solutions designed to meet the “lightweight/integration needs,” “real-time needs,” and “versatility needs” of different devices. Below is a detailed comparison from technical specifics to practical applications. Comparative Table of Core Technical Differences First, let’s use a table to visualize the key distinctions between the three, followed by in-depth breakdowns: Comparison Dimension MIPI Interface Camera DVP Interface Camera USB Interface Camera Interface Nature Mobile Industry Processor Interface, designed for high-speed image transmission in mobile devices Digital Video Port, a parallel image transmission solution for early embedded devices Universal Serial Bus, a universal cross-device data transmission standard Transmission Method Serial transmission (differential signals, e.g., MIPI-CSI2) Parallel transmission (data sent simultaneously via multiple data lines) Serial transmission (USB 2.0/3.0/3.1 protocol) Transmission Speed High-speed (1.5 Gbps per MIPI-CSI2 lane; scalable with multiple lanes, e.g., 6 Gbps for 4 lanes) Medium-low speed (limited by the number of parallel lines, typically ≤1 Gbps, and prone to interference) Medium-high speed (480 Mbps for USB 2.0, 5 Gbps for USB 3.0, 40 Gbps for USB4) Hardware Dependence Requires a processor supporting the MIPI protocol (e.g., mobile SoCs, embedded AI chips); no built-in “image decoding chip” (relies on the main controller for processing) Needs direct connection to the DVP pins of the main controller (with a large number of parallel lines, e.g., 8/16-bit); no built-in decoding chip (relies on the main controller) Equipped with a built-in “USB image chip (e.g., UVC chip)”; can directly connect to USB-enabled devices (computers, tablets, routers, etc.) without additional adaptation by the main controller Real-Time Performance Extremely high (strong anti-interference of serial differential transmission, latency ≤1 ms; suitable for high-speed continuous shooting and video recording) High (low latency of parallel transmission, but stability affected by interference; latency ≈1–5 ms) Moderate (affected by USB protocol scheduling, latency ≈10–100 ms; can be optimized to under 5 ms with high-speed USB 3.0) Power Consumption Low (designed for mobile devices, low power consumption of differential signals, supports sleep mode) Medium (high static power consumption due to a large number of parallel lines) Medium-high (built-in chip requires independent power supply; max 500 mA for USB 2.0, max 900 mA for USB 3.0) Wiring Complexity Low (only 2–4 pairs of differential lines + a small number of control lines; suitable for internal wiring in small devices) High (requires 8/16 data lines + clock lines + control lines; large number of lines, prone to crosstalk; only suitable for short-distance direct connection) Extremely low (only 1 USB cable needed; supports hot-swapping, can extend to over 5 meters) Compatibility Poor (closed protocol; MIPI cameras from different manufacturers need to match specific main controllers; no universal standard) Poor (no unified standard for parallel pin definitions; requires “point-to-point” adaptation with the main controller) Extremely strong (complies with the UVC (USB Video Class) standard; plug-and-play for almost all USB-enabled devices) In-Depth Analysis of Each Interface: Why Do These Three Interfaces Exist? The three interfaces are designed for entirely different purposes, corresponding to three types of needs: “embedded integration,” “early lightweight use,” and “universal expansion.” 1. MIPI Interface Camera: Built for “Mobile Devices/Highly Integrated Embedded Systems” MIPI is the mainstream image interface for mobile devices (e.g., smartphones, tablets, smartwatches, in-vehicle infotainment systems), with core goals of “high speed, low power consumption, and small size.” 2. DVP Interface Camera: “A Transitional Solution for Early Embedded Devices” DVP was the mainstream image interface for embedded devices before 2010 (e.g., early security cameras, MCU development boards), with a core focus on “simplicity and low cost.” However, this technology has gradually been replaced by MIPI. 3. USB Interface Camera: “Universal Expandable Camera” Designed for “Plug-and-Play” USB cameras are universal image devices for cross-device use, with a core goal of “strong compatibility and easy usability.” They do not require internal device integration and focus on “external expansion.” How to Choose? Decide Based on “Device Type + Needs” 4. Summary: The Essence of Core Differences There is no absolute “superiority or inferiority” among the three; they are merely technical solutions designed for different scenarios. The core of selection lies in “which protocol your device’s main controller supports” and “what kind of user experience you need (integration/versatility/low cost).” Views: 48

In the world of photography and smartphone cameras, zoom capabilities are often highlighted as key features. However, not all zoom technologies are created equal. This article will clearly explain the fundamental differences between optical zoom, digital zoom, and the emerging hybrid zoom technology. Optical Zoom: True Lens Magnification Definition:Optical zoom uses the physical movement of lens elements to magnify an image before it reaches the sensor. This is true magnification that maintains image quality throughout the zoom range. How it works: Advantages: Disadvantages: Best for: Situations where image quality is paramount, such as professional photography or when printing enlargements. Digital Zoom: Software-Based Cropping Definition:Digital zoom is essentially cropping and enlarging a portion of the image after it has been captured by the sensor, using software algorithms to simulate zoom. How it works: Advantages: Disadvantages: Best for: Casual use when some quality loss is acceptable, or when sharing images at small sizes on social media. Hybrid Zoom: The Best of Both Worlds? Definition:Hybrid zoom combines optical zoom with digital zoom and sophisticated software processing to deliver better results than digital zoom alone. How it works: Advantages: Disadvantages: Best for: Smartphone photography where some compromise between quality and convenience is acceptable. Key Comparisons Feature Optical Zoom Digital Zoom Hybrid Zoom Image Quality Excellent Poor Good Zoom Range Limited Unlimited Extended Hardware Needs Complex None Moderate Low Light Perf. Good Poor Fair-Good Cost High Low Moderate Practical Recommendations The Future of Zoom Technology Emerging technologies are blurring the lines between these categories: While optical zoom remains the gold standard for image quality, hybrid solutions are becoming increasingly sophisticated. Understanding these differences allows photographers to make informed decisions about equipment and techniques for their specific needs. Views: 96

Selecting the right endoscopic camera module can be daunting, especially when faced with a sea of specifications and conflicting priorities. Many users struggle to differentiate between models or attempt to integrate all sensors at once, leading to confusion. After extensive research and direct communication with manufacturers, we’ve decoded the key factors for endoscopic module selection. Let’s break it down systematically. Key Models & Market Trends The table below summarizes popular OmniVision (OV) endoscopic camera modules, categorized by resolution, sensor size, and critical parameters: Module Resolution & Frame Rate Sensor Size Pixel Size Image Area Field of View (FOV) OVM6948 200×200@30fps 1/36″ 1.75µmx1.75µm 364µm×364µm Customized OVM6946 400×400@30fps 1/18″ 1.75µmx1.75µm 714μm x 707 µm Customized OCHTA10 400×400@30fps 1/31″ 1.008µmx1.008µm 411.264 µm x 411.264 µm Customized OCHFA10 720×720@30fps 1/17.5″ 1.008µmx1.008µm 733.824µm x 733.824µm Customized OV9734 1280×720@30fps 1/9″ 1.4µmx1.4µm 1819.58 µm x 1033.34 µm Customized OV2740 1920×1080@60fps 1/6″ 1.4µmx1.4µm 2728.8µm x 1549.8µm Customized OH02A10 1920×1080@60fps 1/6″ 1.4µmx1.4µm 2728.8µm x 1549.8 µm Customized OCHSA10 800×800@60fps 1/14.25″ 1.116µmx1.116µm – Customized OCH2B10 1500×1500@60fps 1/7.5″ 1.116µmx1.116µm 1691.856µm x 1691.856 µm Customized Market Insights Critical Parameters for Selection Recommendations by Use Case Conclusion: Tailored Recommendations forYour Needs Choosing the right endoscopic camera module hinges on aligning technical specifications with your clinical or industrial application. Below is a streamlined guide to help you prioritize: By matching your priorities to these recommendations, you can streamline your selection process and avoid costly oversights. Stay tuned for our deep dive into endoscopic modules – the next frontier in medical imaging!   Views: 113

In the fast-paced development of modern inspection technologies, the OV9734 endoscope module has carved out a significant niche for itself, standing out as a reliable and feature-rich solution in both medical and industrial arenas. This blog post will delve deep into the remarkable features, technical specifications, and diverse application fields of the OV9734, highlighting why it has become a go-to choice for professionals. 1. Technical Specifications of the OV9734 Endoscope Module Optical Format and Pixel SizeThe OV9734 typically comes with a specific optical format that is optimized for its applications. While the exact details might vary based on the specific model and customization, it is designed to capture light efficiently. The pixel size is carefully engineered to balance between light sensitivity and resolution. A well – thought – out pixel size allows for better image quality, as it can collect more light per pixel in low – light conditions while still maintaining a high – resolution output. Image Sensor TypeIt is equipped with a high – performance image sensor. This sensor is designed to convert the incoming light into electrical signals accurately. The type of sensor used in the OV9734 is crucial as it determines the overall performance of the module. It can handle a wide range of light intensities, from very low – light situations in industrial pipelines to the relatively brighter environments in some medical procedures. Interface CompatibilityThe OV9734 features an SCCB (Serial Camera Control Bus) interface, which is not only important for its programmable controls but also for seamless integration with other systems. This interface allows for easy communication between the endoscope module and the host device, whether it’s a medical monitoring system or an industrial inspection controller. It enables fast data transfer, ensuring that the captured images are quickly processed and displayed. 2. Key Features of the OV9734 Endoscope Module High – Resolution ImagingThe OV9734 endows users with the power of high – resolution imaging. It can support resolutions like 720p (1280×720) and VGA (640×480), which is a game – changer for a multitude of applications. In medical scenarios, the detailed images it captures play a crucial role in accurate diagnosis. For instance, in dermatology, it can capture the minutest details of skin lesions, helping dermatologists identify the nature of the condition. In industrial quality control, it can detect the tiniest surface imperfections on precision – made parts, ensuring the highest standards of product quality. Excellent SensitivityBoasting a sensitivity of 585mV/Lux – sec, the OV9734 is a true performer even in dimly lit environments. In medical endoscopy, this is of utmost importance. For example, during laparoscopic surgeries, where the internal organs are not brightly lit, the high – sensitivity of the OV9734 allows surgeons to have a clear view of the surgical site. In industrial applications such as inspecting the interiors of aircraft wings, where natural light is scarce, the module can capture clear images without relying on cumbersome external lighting setups. Programmable ControlsEquipped with an SCCB (Serial Camera Control Bus) interface, the OV9734 offers users a high degree of control. The ability to programmatically adjust functions like frame rate, mirroring, and flipping makes it highly adaptable. In medical procedures, doctors can fine – tune the frame rate to match the dynamic nature of the examination. For example, during a live – tissue sampling, a higher frame rate can capture the process in real – time with precision. In industrial inspections, technicians can set the mirroring function to view hard – to – reach areas from different perspectives. Advanced Image ProcessingThe OV9734 comes with a suite of advanced image – processing features. Automatic black – level calibration ensures that the colors in the captured images are accurately represented. This is vital in medical imaging, where color accuracy can be a key factor in diagnosing diseases. Defect pixel correction further enhances the image quality, eliminating any pixel – related artifacts. In industrial inspections, this results in clear and reliable images for analyzing the condition of machinery parts. 3. Application Fields of the OV9734 Endoscope Module Medical Endoscopy Industrial Inspection In summary, the OV9734 endoscope module, with its powerful features, solid technical specifications, and broad – spectrum applications, has firmly established itself as an indispensable tool. Whether it’s saving lives in the medical field or ensuring the smooth operation of industrial machinery, the OV9734 continues to prove its worth. As technology marches forward, we can anticipate even more innovative uses and improvements for this remarkable device, further expanding its impact across various industries. Views: 9

This is a tag cloud, which includes various classifications of camera modules and endoscope modules, and it can quickly guide you to the corresponding products.   Views: 5

Before we go further with the camera module classification, let’s acknowledge the basic definition of the camera module. A compact Camera Module usually called a Camera Module includes four parts: Lens, Sensor, Flexible Printed Circuit(FPC) or Printed Circuit Board(PCB), an image processing chip- Digital Signal Processor(DSP). The important components that determine the quality of a module are Lens, DSP, and Sensor. Camera Module Introduction from SAMSUNG Working Process The light collected by the object through the lens, through the CMOS or CCD integrated circuit, converts the optical signal into an electrical signal. During the processing, it will convert the signal into a digital image signal by the Internal Image Processor (ISP) and then will be further processed by the Digital Signal Processor (DSP), Thus it will be converted into standard GRB, YUV and other format image signals. Classification Distinguishing camera module classification from different dimensions can give us a clearer understanding of camera modules. Usually, there are the following categories, let’s figure it out! 1. Sort by Interface A.Universal Serial Bus (USB): USB was designed to standardize the connection of peripherals to personal computers, both to communicate with and to supply electric power. B.Mobile Industry Processor Interface (MIPI): standard defines industry specifications for the design of mobile devices such as smartphones, tablets, laptops, and hybrid devices. C.Digital Video Port (DVP): This interface is designed to transmit uncompressed digital video and can be configured to support multiple modes such as DVI-A (analog only), DVI-D (digital only), or DVI-I (digital and analog) D.Low Voltage Differential Signaling (LVDS): is a technical standard that specifies the electrical characteristics of a differential, serial signaling standard. E.Serial Digital Interface (SDI): known as the high-definition serial digital interface (HD-SDI), is standardized in SMPTE 292M; this provides a nominal data rate of 1.485 Gbit/s. 2. Sort by Lens Wide-angle Lens: This type of lens allows more of the scene to be included in the photograph, which is useful in architectural, interior, and landscape photography where the photographer may not be able to move farther from the scene to photograph it. Standard Lens: also known as a “normal lens”, is one that produces an image that roughly matches what the human eye sees, and which looks natural to the viewer. It sits between the telephoto lens and the wide-angle lens, which produce unnaturally zoomed-in and zoomed-out images respectively. Telephoto Lens: Telephoto lenses have longer focal lengths and are great for bringing distant scenes and subjects closer. Zoom Lens: Technically speaking, a single lens made up of multiple glass elements, can change its effective angle of view by moving certain elements within the lens as a whole. Visually, this gives the effect of “zooming in” or “zooming out”, while maintaining a sharp image. Pinhole Lens: It is a simple camera without a lens but with a tiny aperture (the so-called pinhole)—effectively a light-proof box with a small hole in one side. 3. Sort by Imaging Color Camera Module Black and White Camera Module Infrared Camera Module 4. Sort by Sensor Type CCD Camera Module (Charge-coupled Device) CMOS Camera Module (Complementary Metal Oxide Semiconductor) For more detail you want to know about the difference between CCD and CMOS, please refer to the post: CMOS VS CCD, Which Performs a Better Vision? 5. Sort by Focus Fixed Focus Camera Module: A photographic lens for which the focus is not adjustable is called a fixed-focus lens or sometimes focus-free. Auto Focus Camera Module: An autofocus (or AF) optical system uses a sensor, a control system, and a motor to focus on an automatically or manually selected point or area. Zoom Camera Module. 6. Sort by Sensor Package Chip Scale Package (CPS)： A chip-scale package or chip-scale package (CSP) is a type of integrated circuit package. check more on Wiki about Chip Scale Package. (COB)： Chip on board (COB) is a method of circuit board manufacturing in which the integrated circuits (e.g. microprocessors) are attached (wired, bonded directly) to a printed circuit board, and covered by a blob of epoxy. By eliminating the packaging of individual semiconductor devices, the completed product can be more compact, lighter, and less costly. Check more on Wiki about Chip on board. Views: 36

CMOS Complementary Metal Oxide Semiconductor CCD Charge-Coupled Device 1. Imaging Process The principle of photoelectric conversion CMOS VS CCD image sensors is the same. The main difference between them is that the readout process of the signal is different. The CCD has only one (or a few) output nodes to read out uniformly, the consistency of its signal output is very good. In the CMOS chip, each pixel has its own signal amplifier, which performs charge-voltage conversion, and the consistency of its signal output is poor. However, in order to read out the entire image signal. the CCD requires a wide signal bandwidth of the output amplifier. In a CMOS chip, the bandwidth requirement of the amplifier in each pixel is low, which greatly reduces the power consumption of the chip. This is the main reason CMOS has lower power consumption than CCD. Despite the reduced power consumption, the inconsistency of the multi-million amplifiers results in higher stationary noise, again an inherent disadvantage of CMOS over CCD. 2. Integration From the point of view of the manufacturing process, the circuits and devices in CCD are integrated with semiconductor single-crystal material manufacturers, and the process is more complicated. Only a few manufacturers in the world can produce CCD wafers, such as DALSA, SONY, Panasonic, and so on. The CCD can only output analog electrical signals, which requires subsequent processing by address decoders, analog converters, and image signal processors. It also needs to provide three groups of power synchronous clock control circuits with different voltages, so the integration level is very low. CMOS is integrated into a single material called metal oxide. This process is the same as the process of producing tens of thousands of semiconductor integrated circuits such as computer chips and storage devices. Therefore, the cost of producing CMOS is much lower than that of CCD. At the same time, the CMOS chip can integrate the image signal amplifier, signal reading circuit, A/D conversion circuit, image signal processor, and controller into one chip. Only one chip can realize all the basic functions of the camera, and the integration is very high. The high, chip-scale camera concept was born from this. With the continuous development of CMOS imaging technology, more and more companies can provide high-quality CMOS imaging chips, including Micron, CMOSIS, Cypress, etc. 3. Speed CCD adopts photosensitive output one by one, and can only output according to the specified program, and the speed is relatively slow. CMOS cameras have the potential for higher frame rates, as the process of reading out each pixel can be done more quickly than with the charge transfer in a CCD sensor’s shift register. For digital cameras, exposures can be made from tens of seconds to minutes, although the longest exposures are only possible with CCD cameras, which have lower dark currents and noise compared to CMOS. The noise intrinsic to CMOS imagers restricts their useful exposure to only seconds. 4. Noise CCD technology has developed earlier and is relatively mature. It uses a PN junction or silicon dioxide (SiO2) isolation layer to isolate noise, and the imaging quality has certain advantages over CMOS photoelectric sensors. Due to the high integration of CMOS image sensors, the distance between components and circuits is very close, so there are have some interference, and the noise has a great impact on the image quality. In recent years, with the continuous development of CMOS circuit noise reduction technology, good conditions are provided for the production of high-density and high-quality CMOS image sensors. With the advancement of CMOS image sensor technology, it has the advantages of fast imaging speed, low power consumption, and low cost. Therefore, most of the industrial cameras on the market now use CMOS image sensors. 5. Applications There are very many applications where both types of technology are important. In general, a need for CCD technology can be seen in life science, as well as in high-end inspection applications – that is, applications where high image quality is required, such as in microscopy – but also in applications where longer exposure times play a major role. Here, CCDs can exploit their advantage of a lower dark current. A wide range of applications is opening up for global shutter CMOS technology: From traditional automation inspection of a production line to traffic applications. We are also seeing a lot of interest in many 3D scanner applications. There, CMOS technology is preferred due to lower power consumption and often lower cost. While not impossible, it is more difficult to work with a rolling shutter for 3D scanning. Therefore, a global shutter CMOS sensor is especially worthwhile for any kind of 3D scanning application. Different applications demand different requirements. Anyway, all that matter is to choose the right chip to assemble your product perfectly according to your own needs. Views: 211

The camera modules have various different application areas, and most customers’ needs also vary a lot. Offering customized camera module service to meet the customers’ requirements is crucial and necessary. In the process of customization, effective communication between the two parties about their respective needs can help the entire customization process to proceed more smoothly. Usually includes the following key steps： Requirements Proposal It would be better if you could have very specific, detailed, and clear requirements for your customized products, in this way we are able to offer the best solutions tailed to your needs within the shortest possible.  Solutions Communication Our company provides solutions according to your needs, we would propose a one-stop solution suitable for your requirement for you to choose. And then let’s communicate together your ideal camera module solutions further. Drawing Confirmation Confirm with the customers of your module type, sensor type, size, interface and other settings, and we would send you a product drawing diagram to finalize the design. After the customers’ confirmation, let us move forward. Quotation Send the quotation according to the design level of your products. Sample Development Determine the details of the development sample and the delivery time. Communicate at any time to ensure smooth progress. It usually would be completed within 15 days. Sample Testing Send the first sample for confirmation, and mass production would be started after confirmation. Mass Production During mass production, production and quality control of mass-produced products would be carried out, to be sure that customized R&D and production of the camera module can be completed with high quality and quantity since it meets the customer’s requirements.   Shipping Start shipping and keep tracking the good’s transportation throughout the process. Views: 68